Production Capabilities

SDT has in-house harness electronic board assembly conformal coating and mechanical assembly capabilities.

The Standards applied:

  • MIL-STD-454 Workmanship Standard
  • MIL-STD-130 Product Definition and Traceability
  • MIL-STD-2000 for Soldering Process
  • IPC-J-STD-001D Electronic Assembly
  • Cable and Cable Set Acceptance Standard
  • IPC 7711-7721 Rework/ Repair and Modification Program
  • IPC /WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

Production Activities

  • Electronic Component Assembly per IPC Standards DIP, SMD, BGA etc.
  • 0402, 0603, 0805 and larger Chip Resistors and Capacitors
  • QFN, QFP, TQFN, TQFP, BGA (0.8 , 1.0 , 1.25 mm pitch size), Chip Scale Package (0,5 mm pitch size)
  • Micro-D and Nano-D, 38999 and all type Wire to Board ve Board to Board connector assembly
  • Harness per IPC Standards
  • D38999 Series Connector and Harness Assembly
  • Shielded Harness Assembly
  • EMI Test Harness assembly
  • In-case Harness Assembly
  • EMI/EMC Compatible Device Box Design and Assembly
  • Shock absorber mount
  • Gasket, seal, o-ring mount
  • D-ZUS mount etc.