Hardware Design

  • Power supply design for embedded systems,
  • Preconditioning and control circuits for embedded systems,
  • Protection circuits for signal and power lines,
  • Filtering circuits for EMI/EMC purposes,
  • Designs for wireless media data communication,
  • Signal matching and analog/digital converters for sensors,
  • Digital interface circuit designs,
  • Image processing (compression/decoding),
  • Design of circuits with microprocessors and microcontrollers,
  • Design of FPGA-based digital circuits,
  • Circuits with Digital Signal Processors,
  • Crypto Hardware Design,
  • PCB design with all chip scale packages and embedded passive elements


Mechanical Design

  • Environmental harmonization/consolidation for military and avionics applications
  • 3-D Solid Modelling
  • Preparation of technical drawings
  • Thermal analysis
  • Testing Infrastructure (For Aging and Pre-Qualification Tests)
  • Prototyping/Final assembly


Software Development

SDT has the necessary processes and tools for the analysis, design, coding and testing of various software components, from embedded software to enterprise solutions.

The processes have been developed in compliance with various military and commercial standards, including MIL-STD-498 and IEEE-12207.

SDT uses different programming languages and development environments, and develops software that can run on different operating systems.

Appropriate development lifecycles, methods and computer-aided software engineering tools are selected and implemented in accordance with the programme requirements.


Mil Std 498

Ieee 1207

Engineering Support

Technical Documentation

From the SCD/SoCD product to reference M-STD-100 for production and MIL-STD-490 for parts to be purchased.

Documents prepared for production Their types 

  • Tree Diagram
  • Outline Drawing
  • Block Diagram
  • Schematic diagram
  • Interconnection-Cabling Diagram
  • Cable List
  • Assembly, Mechanics
  • Cable Groups
  • Circuit Board Mechanism
  • Mechanical Parts; Detailed Drawing
  • Equipped, Integrally Assembled fabricated products
  • PCB Manufacturing Drawing
  • Installation Drawing
  • Modification/Modified Items Drawing

Electronic Production

SDT carries out cabling production, card mounting, conformal coating and electronic box assembly processes within its own facilities.


Applicable standards:

  • MIL-STD-454 Labour Standard
  • MIL-STD-130 Product Identification and Traceability
  • MIL-STD-2000 for Solder Workmanship
  • IPC-J-STD-001D Electronics Production Standard
  • IPC-A-610 Acceptability Standard for Cables and Cabling Tools
  • IPC 7711-7721 Rework/ Repair and Modification Programme
  • IPC /WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies



The EMI/EMC laboratory includes an anechoic chamber measuring 5.92 m x 5.60 m x 3.50 m that provides leak tightness up to 40 GHz and meets the specifications required by the MILSTD-461-E/F standard. Attenuation up to 40 GHz can be achieved within the chamber. These are equipment-based tests that are applied in accordance with MIL-STD-461E/F, and include immunity through radiation, dissipation through radiation, immunity through transmission, and dissipation through transmission.

In addition, tests for MIL-STD-704 and MIL-STD-1275, which are electrical power characteristic standards, and ESD tests according to AECTP-500/Category 501 and RTCA/DO-160 standards are among the laboratory’s testing capabilities for equipment used in air and land vehicles.


Production Activities

  • Mounting of all kinds of DIP, SMD and BGA electronic components, as defined in the IPC Standards
  • 0402, 0603, 0805 and larger resistor and capacitor mounting
  • Mounting of all QFN, QFP, TQFN, TQFP, BGA (0.8, 1.0, 1.25 mm pitch size), Chip Scale Package (0.5 mm pitch size) and larger package circuits
  • Assembly of all types of Wire to Board and Board to Board connectors, including
  • Micro-D, Nano-D and 38999-Series Connectors
  • Cabling applications, the acceptance criteria of which are specified in the IPC Standards


  • D38999 connector cabling production
  • Armoured and shielded cabling production
  • EMI test cabling production
  • In-device cabling production
  • Assembly of EMI/EMC-compatible device box and sub-parts
  • Shock absorber assembly
  • Gasket, seal, o-ring assembly
  • D-ZUS assembly, etc.


Analyses and services offered within the scope of ILS

  • Integrated Logistic Support Analyses/Reports
  • Maintenance Plan Analyses/Reports
  • FMECA Analyses/Reports
  • MTBF Analyses/Reports
  • Maintainability Analyses/Reports
  • Reliability Analyses/Reports
  • Testability Analyses/Reports
  • Security Analyses/Reports
  • Spare Parts and Field Support Analyses/Reports
  • User Manual and/or Device Maintenance Analysis Manual
  • Contractual customer/user training documents
  • Other contractual documents and reports
  • For MTBF and MTTR analyses, LAMBDA PREDICT software as well as internal software are used.

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